CSYS-GPU-6700
VINCANWO GROUP
High Performance (Core i/ultra)
1x DDR5 SO-DIMM, Onboard LPDDR5
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The CSYS-GPU-6700 is a high-density 2U rack-mounted PCIe GPU computing system independently developed and supplied by Vincanwo Group, built on Intel’s enterprise-grade server hardware architecture and fully optimized to carry NVIDIA H200 Tensor Core GPUs. Positioned for high-performance parallel computing workloads, this integrated GPU server balances rack space utilization, thermal dissipation, expandability and stable sustained performance, targeting enterprise-level AI training, large language model (LLM) inference, scientific simulation, high-precision computational fluid dynamics (CFD), big data analytics and digital twin computing scenarios.
Adopting a standard 2U rack chassis form factor compliant with universal data center cabinet specifications, the system leverages Intel’s validated server motherboard, power delivery subsystem and platform firmware ecosystem, eliminating compatibility risks between x86 host hardware and NVIDIA H200 accelerators while delivering long-term operational reliability for 24/7 non-stop data center operation.
The entire computing platform adopts Intel’s enterprise x86 server motherboard with dual-socket Intel Xeon scalable processors as the central computing core. The motherboard features full PCIe 5.0 high-speed expansion lanes natively supported by Intel Xeon CPUs, which matches the full bandwidth demand of NVIDIA H200 PCIe variant GPUs to avoid I/O bottlenecks between host CPU memory and GPU high-bandwidth memory (HBM3e).
Integrated Intel platform controller hub (PCH) provides stable signal transmission, enterprise-grade remote management functions (Intel AMT/IPMI 2.0 standard), hardware fault monitoring and out-of-band remote maintenance, enabling data center operators to perform power control, hardware diagnostics and system reinstallation without on-site access.
Supported by Intel’s memory controller technology, the server motherboard accommodates high-capacity DDR5 ECC registered server memory modules with error correction and memory mirroring functions to prevent computing interruption caused by single-bit memory errors during long-duration AI training tasks.
Multiple hot-swappable NVMe U.2/SFF drive bays are configured on the front panel, connected via Intel-native PCIe 4.0 storage channels, supporting ultra-high-speed local dataset storage and low-latency model loading. Optional Intel RAID controllers are available to build redundant storage arrays for critical model and training data backup.
All power supply modules and thermal solution frameworks pass Intel platform compatibility certification. The chassis integrates high-efficiency redundant platinum-level hot-swappable power supplies to eliminate single-point power failure risks; intelligent power management logic from Intel dynamically adjusts power output according to CPU and GPU load to reduce idle power consumption and cut data center OPEX.
The 2U air cooling framework is structurally reinforced to fit the thermal dissipation requirements of multiple high-power NVIDIA H200 GPUs, with front-to-back forced air duct design optimized by Intel’s thermal simulation tools to maintain consistent airflow across all accelerator cards and avoid local overheating under full sustained GPU load.
The CSYS-GPU-6700 system is engineered as a dedicated PCIe GPU node for NVIDIA H200 accelerators (PCIe form factor, not SXM variant), with configurable multi-GPU slot layouts tailored to large-scale parallel computing:
Each NVIDIA H200 PCIe GPU is equipped with up to 141GB HBM3e high-bandwidth memory, delivering extreme memory throughput to handle ultra-large foundation models without frequent offloading to system RAM or slow external storage;
Powered by NVIDIA Blackwell GPU architecture with advanced Tensor Cores supporting FP4, FP8, FP16, BF16 and FP32 mixed-precision computing, drastically accelerating LLM training, generative AI inference, multi-modal model processing and scientific numerical simulation;
Full compatibility with NVIDIA CUDA, cuDNN, TensorRT, NeMo and NVIDIA AI Enterprise software stack; the Intel host platform ensures seamless driver, container and orchestration tool integration for Kubernetes, Slurm and other cluster scheduling frameworks.
PCIe 5.0 x16 full-width slots provide unthrottled bidirectional data throughput between each H200 GPU and Intel Xeon host CPUs, removing data transfer bottlenecks common in older PCIe 4.0 GPU servers.
Form Factor: 2U rackmount, standard 19-inch data center cabinet mounting bracket compatible;
Dimensions: Industry-standard 2U height design to maximize rack density—more computing nodes can be deployed per rack compared to 4U/5U large GPU servers, lowering overall data center footprint and cabinet procurement costs;
Expansion Layout: Optimized internal space layout by Vincanwo Group, with reinforced PCIe card retention brackets to stabilize heavy NVIDIA H200 accelerators during cabinet vibration or transport;
Front Panel Interface: Hot-swappable storage bays, status LED indicators for CPU, memory, GPU, power supply and fan faults, physical power switch and USB diagnostic ports;
Rear Panel Interface: IPMI remote management Ethernet port, multiple 10G/25G high-speed network optical electrical ports (supported via Intel PCIe network adapters), redundant power supply modules, expansion slot rear baffles for heat exhaust.
Large Language Model (LLM) Training & Inference
The combination of Intel dual Xeon host computing and multi-NVIDIA H200 HBM3e memory eliminates memory capacity limits for trillion-parameter foundation models, supporting both offline full training and online low-latency reasoning deployment.
Multi-Modal Generative AI Computing
Suitable for text-image, text-video, audio generation model training and batch inference workloads, leveraging Blackwell Tensor Core mixed-precision acceleration to shorten task cycle time.
High-Performance Scientific Computing
Aerodynamic simulation, molecular dynamics, medical imaging reconstruction, weather prediction and geophysical modeling—scalable parallel computing via Intel multi-core CPUs and clustered H200 GPUs.
Enterprise Big Data & Digital Twin
Real-time industrial digital twin rendering, financial risk quantitative modeling, large-scale user behavior data mining with GPU-accelerated database and data lake computing.
AI Cloud Service Node
Can be deployed as standardized bare-metal GPU computing nodes for public/private AI clouds, with Intel IPMI remote management simplifying cloud resource scheduling and tenant hardware isolation.
Verified Dual Ecosystem Compatibility
Fully validated joint platform of Intel enterprise server hardware and NVIDIA H200 PCIe GPU, eliminating third-party hardware incompatibility issues common in custom-assembled GPU workstations.
High Density 2U Space-Saving Design
Unlike bulky 4U GPU servers, the compact 2U rack design improves rack deployment density and reduces data center space, cooling and power overhead expenses.
Industrial-Grade 24/7 Stability
Redundant power supplies, ECC error correction memory, intelligent thermal fan regulation and hardware fault alarm systems meet continuous operation requirements for data center production environments.
Customizable Configuration Flexibility
Vincanwo Group supports customer personalized configuration adjustments: customizable Xeon CPU generations, DDR5 memory capacity, NVMe storage quantity, number of deployed NVIDIA H200 GPUs, and optional high-speed network adapters.
One-Stop Supply & After-Sales Service
As the product developer and supplier, Vincanwo Group provides integrated delivery of complete Intel server systems pre-installed with NVIDIA H200 GPUs, together with unified hardware warranty, technical debugging, cluster deployment guidance and post-sales technical support.
The CSYS-GPU-6700 2U PCIe GPU System by Vincanwo Group is a purpose-built high-performance computing node built upon Intel’s mature enterprise server platform, specially optimized to operate NVIDIA H200 PCIe Tensor Core GPUs. It integrates robust x86 host computing, ultra-large GPU HBM memory capacity, high-speed PCIe 5.0 interconnection and compact rack density, delivering a reliable, scalable and cost-effective hardware solution for enterprise-grade artificial intelligence, high-performance scientific computing and cloud GPU service workloads.
| Product Name and Model | CSYS-GPU-6700 | |
| Chassis | Form Factor | 2U Rackmount |
| Processor | CPU | Single Socket E2 (LGA-4710) Intel® Xeon® 6700/6500 series processors with P-cores |
| Core Count | Up to 80C/160T; Up to 336MB Cache | |
| Note | Supports up to 350W TDP CPUs (Air Cooled) | |
| GPU | Max GPU Count | Up to 4 double-width GPUs |
| Supported GPU | NVIDIA PCIe: H200 NVL (141GB), NVIDIA RTX PRO™ 6000 Blackwell Server Edition Intel: Arc™ Pro B70 Graphics | |
| CPU-GPU Interconnect | PCIe 5.0 x16 CPU-to-GPU Interconnect | |
| GPU-GPU Interconnect | NVIDIA® NVLink™ Bridge (optional) | |
| System Memory | Memory | Slot Count: 16 DIMM slots/8 Channels Max Memory (1DPC): Up to 1TB 6400MT/s ECC DDR5 RDIMM Max Memory (1DPC): Up to 512GB 8000MT/s ECC DDR5 MRDIMM Max Memory (2DPC): Up to 2TB 5200MT/s ECC DDR5 RDIMM |
| Memory Voltage | 1.1V | |
| Input / Output | LAN | 1 RJ45 1 GbE Dedicated BMC LAN port |
| USB | 1 USB 3.0 Type-A port(Rear) | |
| Video | 1 mini-DP port | |
| System BIOS | BIOS Type | AMI 64MB SPI Flash EEPROM |
| Management | Power configurations | Power-on mode for AC power recovery ACPI Power Management |
| Security | Hardware | Trusted Platform Module (TPM) 2.0 Silicon Root of Trust (RoT) – NIST 800-193 Compliant |
| Features | Cryptographically Signed Firmware Secure Boot Secure Firmware Updates Automatic Firmware Recovery Supply Chain Security: Remote Attestation Runtime BMC Protections System Lockdown | |
| PC Health Monitoring | CPU | 8+4 Phase-switching voltage regulator Monitors for CPU Cores, Chipset Voltages, Memory |
| Fan | Fans with tachometer monitoring Pulse Width Modulated (PWM) fan connectors Status monitor for speed control | |
| Temperature | Monitoring for CPU and chassis environment Thermal Control for fan connectors | |
| Certifications | Operating Systems | Oracle Linux 9.6, RHEL 10.0, Windows Server 2022, Windows Server 2025 |
| Dimensions and Weight | Dimensions | H:88mm x W:438.4mm x D: 900mm |
| Weight | Gross Weight: 38 kg Net Weight: 30 kg | |
| Available Color | Black front & silver body | |
| Front Panel | Buttons | Power On/Off button System Reset button |
| LED | Hard drive activity LED Network activity LEDs Power status LED System Overheat & Power Fail LED | |
| Expansion Slots | PCI-Express (PCIe) Configuration | Default 4 PCIe 5.0 x16 FHFL double-width slots 3 PCIe 5.0 x16 FHFL slots |
| M.2 | 2 M.2 PCIe 5.0 x2 NVMe slots (M-key 2280/22110) | |
| Drive Bays / Storage | Drive Bays Configuration | Default: Total 4 bays 4 front hot-swap E1.S NVMe drive bays |
| M.2 | 2 M.2 PCIe 5.0 x2 NVMe slots (M-key 2280/22110) | |
| System Cooling | Fans | Up to 6x 6cm heavy duty fans with optimal fan speed control |
| Air Shroud | 1 Air Shroud | |
| Power Supply | Power supply | 3x 2000W Redundant (2 + 1) Titanium Level (96%) power supplies |
| Dimension (WxHxL) | 73.5 x 40 x 185 mm | |
| Operating Environment | Environmental Spec. | Operating Temperature: 10°C to 35°C Non-operating Temperature: -30°C to 60°C Operating Relative Humidity: 8% to 80% (max 21° DP; non-condensing) Non-operating Relative Humidity: 8% to 90% (max 38° DP; non-condensing) |