SKU | TPRO-SE133 |
Screen Size | 13.3" |
Resolution | 1920*1080 |
Viewing Angle | 85/85/85/85 |
Brightness | 300 cd/m2 |
Contrast Ratio | 800:1 |
Touch Screen | Capacitive |
Controller | USB interface |
Durability | ≥5M times |
Processor | Intel® Processors |
Memory | 4G/8G/16G/32G |
Storag | 128G/256G/512G/1T |
Network | 2 *RTL8111 |
COM | 2 *RS232 (COM2 optional RS485 and expansion to 5COMs) |
USB | 2 *USB3.0 + 2 *USB2.0 |
Display | 1 *HDMI, 1 *VGA |
Expansion | 1 *Mini PCIE WiFi&BT or 4G LTE |
Operating System | Windows / Linux |
Dimensions (mm) | 337*208.5*52 |
Recommended size of holes openning (mm) | 331.5*203 |
Gross weight (kg) | 3.50kg |
Installation methods | Embedded / Wall mount / Desktop |
Operating Temperature | -30 ~ +70°C |
Storage Temperature | -40 ~ +80°C |
Storage Humidity *Non-condensing | 5 ~ 95% |
Power Input | 1*12VDC (6A) <Option 9~36VDC Wide-range Power Input> |
Packaging Information | 1 *Master, 1 *Transformer, 1* Power Supply Cable |
| Feature | TPRO-SE133 Specifications |
|---|---|
| Form Factor | 1U/2U rackmount (standard 19" width) |
| Display | Optional 13.3" LCD (front panel) with resistive/P-CAP touch |
| Processor | Intel® Core™ i5/i7/i9 (12th/13th Gen) or Xeon® E-series |
| RAM | Up to 64GB DDR5 ECC SODIMM |
| Storage | Dual M.2 NVMe (2280) + 2x 2.5" SATA hot-swap bays |
| Power Input | 24V DC (primary) + 100-240V AC backup |
| Operating Temp | -40°C to 70°C (with conformal coating) |
| Ruggedization | Vibration-resistant chassis, IP40 front, MIL-STD-810H compliant |
Rack-Optimized Architecture
Tool-less Rail Kits: Slide rails for rapid deployment in 19" cabinets.
Front-Access I/O: USB 3.2, HDMI, OOB management port for serviceability.
Dual Power: Redundant 300W PSUs (DC + AC) for critical applications.
Edge Computing Capabilities
AI Acceleration: M.2 A-key slot for Intel Movidius/Google Coral TPU.
5G/LTE Support: M.2 B-key slot for cellular modules (Quectel RM500Q).
Real-Time OS Support: Preloaded with Ubuntu RT, QNX, or Wind River VxWorks.
Industrial Connectivity
Legacy I/O: 2x RS-232/485 (isolated), 8x GPIO, CAN Bus 2.0B.
High-Speed Networking: Dual 10GbE SFP+, 4x GbE RJ45 (Intel i225).
Expansion: PCIe x8 riser card (supports GPUs, frame grabbers).
Factory 4.0: Real-time production monitoring, predictive maintenance.
Transportation: Onboard compute for trains/AVGs (EN 50155 certified variants).
Energy: Substation automation (IEC 61850-3 compliance).
Defense: Mobile command centers (MIL-STD-461G EMI shielding).
| Feature | Benefit |
|---|---|
| Standardized Width | Integrates into existing 19" control cabinets, server rooms. |
| High-Density | Fits 42 units per rack (1U) → maximizes compute in limited space. |
| Serviceability | Hot-swap drives/redundant PSUs enable maintenance without downtime. |
| Scalability | Stack multiple units for clustered edge computing (Kubernetes/K3s). |
| Requirement | TPRO-SE133 Solution |
|---|---|
| Temperature Resilience | Conformal coating + wide temp range (-40°C to 70°C) |
| Certifications | CE, FCC, EN 50121-3-2 (railway) |
| Shock/Vibe Resistance | MIL-STD-810H Method 514.8 (30G operational) |
| Security | TPM 2.0, secure boot, Kensington lock slot |
| Management | IPMI 2.0, Redfish API, SNMP v3 support |
Cooling: Maintain ≥ 1U clearance above/below unit; use rack fans if ambient >50°C.
Power: Use industrial 24V DC UPS (e.g., PULS DIMENSION) for brownout protection.
Cabling: Strain-relief clamps for mobile deployments (e.g., mining vehicles).
EMC: Ground chassis to rack; use shielded Cat 6A/7 cables in high-noise environments.
Always verify:
MTBF: ≥ 200,000 hours (calculated per Telcordia SR-332).
Warranty: 5-year coverage (standard for industrial PCs).
Compliance: Region-specific certs (e.g., EAC for Eurasia, KC for Korea).
SKU | TPRO-SE133 |
Screen Size | 13.3" |
Resolution | 1920*1080 |
Viewing Angle | 85/85/85/85 |
Brightness | 300 cd/m2 |
Contrast Ratio | 800:1 |
Touch Screen | Capacitive |
Controller | USB interface |
Durability | ≥5M times |
Processor | Intel® Processors |
Memory | 4G/8G/16G/32G |
Storag | 128G/256G/512G/1T |
Network | 2 *RTL8111 |
COM | 2 *RS232 (COM2 optional RS485 and expansion to 5COMs) |
USB | 2 *USB3.0 + 2 *USB2.0 |
Display | 1 *HDMI, 1 *VGA |
Expansion | 1 *Mini PCIE WiFi&BT or 4G LTE |
Operating System | Windows / Linux |
Dimensions (mm) | 337*208.5*52 |
Recommended size of holes openning (mm) | 331.5*203 |
Gross weight (kg) | 3.50kg |
Installation methods | Embedded / Wall mount / Desktop |
Operating Temperature | -30 ~ +70°C |
Storage Temperature | -40 ~ +80°C |
Storage Humidity *Non-condensing | 5 ~ 95% |
Power Input | 1*12VDC (6A) <Option 9~36VDC Wide-range Power Input> |
Packaging Information | 1 *Master, 1 *Transformer, 1* Power Supply Cable |
| Feature | TPRO-SE133 Specifications |
|---|---|
| Form Factor | 1U/2U rackmount (standard 19" width) |
| Display | Optional 13.3" LCD (front panel) with resistive/P-CAP touch |
| Processor | Intel® Core™ i5/i7/i9 (12th/13th Gen) or Xeon® E-series |
| RAM | Up to 64GB DDR5 ECC SODIMM |
| Storage | Dual M.2 NVMe (2280) + 2x 2.5" SATA hot-swap bays |
| Power Input | 24V DC (primary) + 100-240V AC backup |
| Operating Temp | -40°C to 70°C (with conformal coating) |
| Ruggedization | Vibration-resistant chassis, IP40 front, MIL-STD-810H compliant |
Rack-Optimized Architecture
Tool-less Rail Kits: Slide rails for rapid deployment in 19" cabinets.
Front-Access I/O: USB 3.2, HDMI, OOB management port for serviceability.
Dual Power: Redundant 300W PSUs (DC + AC) for critical applications.
Edge Computing Capabilities
AI Acceleration: M.2 A-key slot for Intel Movidius/Google Coral TPU.
5G/LTE Support: M.2 B-key slot for cellular modules (Quectel RM500Q).
Real-Time OS Support: Preloaded with Ubuntu RT, QNX, or Wind River VxWorks.
Industrial Connectivity
Legacy I/O: 2x RS-232/485 (isolated), 8x GPIO, CAN Bus 2.0B.
High-Speed Networking: Dual 10GbE SFP+, 4x GbE RJ45 (Intel i225).
Expansion: PCIe x8 riser card (supports GPUs, frame grabbers).
Factory 4.0: Real-time production monitoring, predictive maintenance.
Transportation: Onboard compute for trains/AVGs (EN 50155 certified variants).
Energy: Substation automation (IEC 61850-3 compliance).
Defense: Mobile command centers (MIL-STD-461G EMI shielding).
| Feature | Benefit |
|---|---|
| Standardized Width | Integrates into existing 19" control cabinets, server rooms. |
| High-Density | Fits 42 units per rack (1U) → maximizes compute in limited space. |
| Serviceability | Hot-swap drives/redundant PSUs enable maintenance without downtime. |
| Scalability | Stack multiple units for clustered edge computing (Kubernetes/K3s). |
| Requirement | TPRO-SE133 Solution |
|---|---|
| Temperature Resilience | Conformal coating + wide temp range (-40°C to 70°C) |
| Certifications | CE, FCC, EN 50121-3-2 (railway) |
| Shock/Vibe Resistance | MIL-STD-810H Method 514.8 (30G operational) |
| Security | TPM 2.0, secure boot, Kensington lock slot |
| Management | IPMI 2.0, Redfish API, SNMP v3 support |
Cooling: Maintain ≥ 1U clearance above/below unit; use rack fans if ambient >50°C.
Power: Use industrial 24V DC UPS (e.g., PULS DIMENSION) for brownout protection.
Cabling: Strain-relief clamps for mobile deployments (e.g., mining vehicles).
EMC: Ground chassis to rack; use shielded Cat 6A/7 cables in high-noise environments.
Always verify:
MTBF: ≥ 200,000 hours (calculated per Telcordia SR-332).
Warranty: 5-year coverage (standard for industrial PCs).
Compliance: Region-specific certs (e.g., EAC for Eurasia, KC for Korea).
