23.6” Android Fanless Industrial Computer | VOPC-236 ARM
VINCANWO GROUP
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SKU | VOPC-236 ARM |
Screen Size | 23.6” |
Resolution | 1920 x1080 |
Viewing Angle | 89/89/89/89 |
Brightness | 250 cd/㎡ |
Contrast Ratio | 3000:1 |
Touchscreen | Capacitive |
Controller | USB interface |
Durability | ≥ 5M times |
Processor Family | ARM, Rockchip |
Memory Type | 2G, 4G, 8G |
Ethernet / LAN | 2x LAN |
Serial / Com | 2x RS232 (1x COM option RS485) |
USB | 2x USB |
Video Outputs | 1x HDMI |
Expansion Slots | 1x Mini PCIE |
Operating Systems | Android, Linux |
Dimension | 572.1x345.6 x51.3mm |
Mounting Hole Size | 567.6x341.2mm |
Gross Weight | 6.00kg |
Mounting Options | Embedded, Wall Mount, Desktop Stand |
Operating Temperature | -30℃ ~ +70℃ |
Storage Temperature | -40℃ ~ +80℃ |
Humidity Rage Non-condensing | 5% - 95% |
Power | Input Voltage Range 9 – 36V DC Standard Power: Optional 12V AC/DC Adapter: 5A, 60W |
Feature | VOPC-236 ARM Specifications |
---|---|
Display | 23.6" IPS LCD (1920×1080 FHD) |
Processor | Rockchip RK3588 (4× Cortex-A76 @ 2.4GHz + 4× Cortex-A55) |
AI Acceleration | 6 TOPS NPU (supports INT4/INT8/FP16) |
OS | Android 12 (AOSP) w/ 10-year LTS support |
Memory/Storage | 8GB LPDDR5 + 128GB eMMC 5.1 (expandable via microSD) |
Operating Temp | -20°C to +60°C (fanless, aluminum heatsink) |
Ingress Protection | IP65 front / IP42 rear |
Power Input | 24V DC (12–36V) or PoE++ (802.3bt, 71W) |
Construction | Cast aluminum chassis, 5mm chemically-strengthened glass |
Industrial-Grade Android Stack
Deterministic Extensions: Real-time kernel patches (Preempt-RT) for ≤100 µs I/O latency
Fieldbus Support: PROFINET, Modbus TCP, EtherCAT via OPC UA gateway apps
Secure Boot: Hardware-rooted trust (TEE + TPM 2.0)
Edge AI Capabilities
Framework Support: TensorFlow Lite, MediaPipe, ONNX Runtime for NPU acceleration
Camera Integration: Dual MIPI-CSI (4-lane) for 8MP industrial cameras
Preloaded Tools: DeepView RT analytics suite (defect detection, OCR)
Ruggedization
Vibration Resistance: 5Grms (IEC 60068-2-64)
Conformal Coating: PCB protection against humidity/chemicals
EMC Compliance: EN 55032/35, IEC 61000-4-6 (industrial RF immunity)
Interface | Automation Use Case |
---|---|
Field I/O | 8× GPIO (isolated 24V@100mA), 2× RS-485, 1× CAN 2.0B |
Networking | Dual GbE w/ TSN, Wi-Fi 6E + BT 5.3 (M.2 Key E) |
Expansion | USB 3.1 (Type-C w/ DP Alt), HDMI 2.0, M.2 M-key (NVMe) |
Wireless | Optional 5G/LTE (Quectel RM520N-GL) |
Warehouse Logistics: AMR fleet management dashboards (ROS 2 via Android NDK)
Smart Manufacturing: MES visualization with OPC UA Pub/Sub
Food & Beverage: Washdown-compatible production monitoring (IP65/NSF 49)
Energy: Solar farm SCADA with Modbus-TLS security
Component | Industrial Implementation |
---|---|
PLC Integration | Ignition Edge for Android (Modbus/OPC UA) |
HMI Development | VTScada Mobile, Siemens WinCC Unified |
Containerization | Docker via Anbox(Android + Linux hybrid) |
Security | Azure Sphere for Over-the-Air updates |
Workload | Performance |
---|---|
AI Inference | 42 fps (YOLOv5s @ 640×640 INT8) |
Real-Time Control | 100 µs cycle time (w/ Preempt-RT) |
Display Latency | 8 ms (touch-to-response) |
Power Consumption | 12W idle / 28W peak (NPU active) |
Thermal Management
Maintain ≥20mm air gap behind unit in ambient >50°C
Apply thermal interface pads (Laird Tflex HD900) between PCB/chassis
Android Hardening
Disable USB debugging in production
Use Android Enterprise for kiosk mode/enforced OS policies
Field Integration
Isolate CAN/RS-485 with ADuM3151BRWZgalvanic isolators
Use M12 connectors for vibration-prone environments
SKU | VOPC-236 ARM |
Screen Size | 23.6” |
Resolution | 1920 x1080 |
Viewing Angle | 89/89/89/89 |
Brightness | 250 cd/㎡ |
Contrast Ratio | 3000:1 |
Touchscreen | Capacitive |
Controller | USB interface |
Durability | ≥ 5M times |
Processor Family | ARM, Rockchip |
Memory Type | 2G, 4G, 8G |
Ethernet / LAN | 2x LAN |
Serial / Com | 2x RS232 (1x COM option RS485) |
USB | 2x USB |
Video Outputs | 1x HDMI |
Expansion Slots | 1x Mini PCIE |
Operating Systems | Android, Linux |
Dimension | 572.1x345.6 x51.3mm |
Mounting Hole Size | 567.6x341.2mm |
Gross Weight | 6.00kg |
Mounting Options | Embedded, Wall Mount, Desktop Stand |
Operating Temperature | -30℃ ~ +70℃ |
Storage Temperature | -40℃ ~ +80℃ |
Humidity Rage Non-condensing | 5% - 95% |
Power | Input Voltage Range 9 – 36V DC Standard Power: Optional 12V AC/DC Adapter: 5A, 60W |
Feature | VOPC-236 ARM Specifications |
---|---|
Display | 23.6" IPS LCD (1920×1080 FHD) |
Processor | Rockchip RK3588 (4× Cortex-A76 @ 2.4GHz + 4× Cortex-A55) |
AI Acceleration | 6 TOPS NPU (supports INT4/INT8/FP16) |
OS | Android 12 (AOSP) w/ 10-year LTS support |
Memory/Storage | 8GB LPDDR5 + 128GB eMMC 5.1 (expandable via microSD) |
Operating Temp | -20°C to +60°C (fanless, aluminum heatsink) |
Ingress Protection | IP65 front / IP42 rear |
Power Input | 24V DC (12–36V) or PoE++ (802.3bt, 71W) |
Construction | Cast aluminum chassis, 5mm chemically-strengthened glass |
Industrial-Grade Android Stack
Deterministic Extensions: Real-time kernel patches (Preempt-RT) for ≤100 µs I/O latency
Fieldbus Support: PROFINET, Modbus TCP, EtherCAT via OPC UA gateway apps
Secure Boot: Hardware-rooted trust (TEE + TPM 2.0)
Edge AI Capabilities
Framework Support: TensorFlow Lite, MediaPipe, ONNX Runtime for NPU acceleration
Camera Integration: Dual MIPI-CSI (4-lane) for 8MP industrial cameras
Preloaded Tools: DeepView RT analytics suite (defect detection, OCR)
Ruggedization
Vibration Resistance: 5Grms (IEC 60068-2-64)
Conformal Coating: PCB protection against humidity/chemicals
EMC Compliance: EN 55032/35, IEC 61000-4-6 (industrial RF immunity)
Interface | Automation Use Case |
---|---|
Field I/O | 8× GPIO (isolated 24V@100mA), 2× RS-485, 1× CAN 2.0B |
Networking | Dual GbE w/ TSN, Wi-Fi 6E + BT 5.3 (M.2 Key E) |
Expansion | USB 3.1 (Type-C w/ DP Alt), HDMI 2.0, M.2 M-key (NVMe) |
Wireless | Optional 5G/LTE (Quectel RM520N-GL) |
Warehouse Logistics: AMR fleet management dashboards (ROS 2 via Android NDK)
Smart Manufacturing: MES visualization with OPC UA Pub/Sub
Food & Beverage: Washdown-compatible production monitoring (IP65/NSF 49)
Energy: Solar farm SCADA with Modbus-TLS security
Component | Industrial Implementation |
---|---|
PLC Integration | Ignition Edge for Android (Modbus/OPC UA) |
HMI Development | VTScada Mobile, Siemens WinCC Unified |
Containerization | Docker via Anbox(Android + Linux hybrid) |
Security | Azure Sphere for Over-the-Air updates |
Workload | Performance |
---|---|
AI Inference | 42 fps (YOLOv5s @ 640×640 INT8) |
Real-Time Control | 100 µs cycle time (w/ Preempt-RT) |
Display Latency | 8 ms (touch-to-response) |
Power Consumption | 12W idle / 28W peak (NPU active) |
Thermal Management
Maintain ≥20mm air gap behind unit in ambient >50°C
Apply thermal interface pads (Laird Tflex HD900) between PCB/chassis
Android Hardening
Disable USB debugging in production
Use Android Enterprise for kiosk mode/enforced OS policies
Field Integration
Isolate CAN/RS-485 with ADuM3151BRWZgalvanic isolators
Use M12 connectors for vibration-prone environments