15.6” Fanless Android Panel PC | TPRO-156 ARM
VINCANWO GROUP
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SKU | TPRO-156 ARM Widescreen |
Screen Size | 15.6” |
Resolution | 1920x1080 |
Viewing Angle | 89/89/89/89 |
Brightness | 250 cd/㎡ |
Contrast Ratio | 1000:1 |
Touchscreen | Capacitive, Resistive |
Controller | USB interface |
Durability | Capacitive: ≥ 5M times, Resistive: : ≥ 100,000 times |
Processor Family | ARM, Rockchip |
Memory Type | 2G, 4G, 8G |
Storage Type | 3588: 64G, 128G, 256G |
Ethernet / LAN | 2x LAN |
Serial / Com | 2x RS232 (1x COM option RS485) |
USB | 2x USB |
Video Outputs | 1x HDMI |
Expansion Slots | 1x Mini-PCIE |
Operating Systems | Android, LInux |
Dimension | 412 *261 *58. 6mm |
Mounting Hole Size | External embedded size:404 x253mm Internal embedded size: 397.5 x241.8mm |
Gross Weight | 3 . 80kg |
Mounting Options | Embedded, Wall Mount, Desktop Stand |
Operating Temperature | -30℃ ~ +70℃ |
Storage Temperature | -40℃ ~ +80℃ |
Humidity Rage Non-condensing | 5% - 95% |
Power | Input Voltage Range 9 – 36V DC Standard Power: Optional 12V AC/DC Adapter: 5A, 60W |
Fanless & Rugged Enclosure:
Fanless Cooling: Passive heatsink design within sealed enclosure. Eliminates dust ingress and fan failure points.
Construction: Aluminum or heavy-duty steel chassis.
Front Panel Rating: Typically IP65 (Dust-tight, protected against low-pressure water jets) - essential for washdown environments or dusty factories.
Ingress Protection: Overall unit rating often IP54/IP65 depending on model.
Wide Operating Temperature: -10°C to 50°C or -20°C to 60°C (common ranges, ARM chips handle extremes well).
Power Input: 12V DC or 24V DC (wide range like 9-36V DC possible) via terminal block or industrial connector. Includes power ignition control (optional).
Mounting: Panel Mount (Flush or Surface) with standard cutout size (e.g., 362.5 x 226.5mm). May include VESA mount options (75x75/100x100mm).
Certifications: CE, FCC, RoHS. Industrial EMC standards (EN 61000-6-2, EN 61000-6-4). May have MIL-STD-810G for shock/vibration.
Longevity & Reliability: Designed for 24/7 operation with industrial-grade components. Long-term OS support availability is a key question.
USB Ports: 2-4x USB 2.0/3.0 Host ports (Type-A, some ruggedized).
Serial Port: 1-2x RS-232/485 (DB9 or terminal block, often isolated).
Ethernet: 1-2x 10/100/1000 Mbps RJ45 (Gigabit).
Wi-Fi & Bluetooth: Integrated 802.11 a/b/g/n/ac/ax (Wi-Fi 5/6) and Bluetooth 4.2/5.0+.
Digital I/O (GPIO): 4-8x Isolated Inputs/Outputs(for sensors/relays).
Audio: Line-out/Mic-in (3.5mm jack or screw terminal).
Expansion: Mini-PCIe slot (for 4G/5G modem, CANbus card, extra storage).
Optional: CAN Bus 2.0B (critical for vehicles/machinery), PoE (Power over Ethernet), Barcode Scanner Input, Secondary Video Output(HDMI/LVDS).
Lower Cost: ARM SoCs are generally cheaper than equivalent x86 CPUs.
Ultra-Low Power: Minimal heat, ideal for sealed fanless designs.
Instant On/Fast Boot: Boots much faster than Windows/Linux.
Touch-Optimized UI: Android is inherently designed for touch interaction.
App Ecosystem: Access to vast number of Android apps (requires vetting for stability).
Simplified Development: Easier for creating custom HMIs using Android SDK/Kotlin/Java vs. traditional SCADA systems.
Industrial HMI (Human-Machine Interface):Machine control, process visualization, SCADA operator panels.
Factory Automation: Production line monitoring, quality control stations.
Kiosks & Interactive Signage: Wayfinding, self-service terminals, POS, menu boards.
Building Automation: HVAC control, security system panels, smart building interfaces.
Transportation: Fleet management terminals, in-vehicle infotainment (buses/trains), logistics tracking.
Medical Devices: Patient monitoring interfaces, diagnostic equipment UIs.
Thin Clients: Secure access to cloud/Virtual Desktop environments.
IoT Gateways & Edge Control: Running lightweight Android apps for data aggregation and local control.
Android Version & Support: What version is pre-installed? How long will security updates be provided? Is the kernel version locked? Can it be upgraded?
Processor Performance: ARM performance varies hugely (e.g., RK3568 vs. RK3588). Match the CPU to your app complexity (basic UI vs. video decoding/ML).
Storage & RAM: Ensure sufficient eMMC and RAM for your OS, apps, and data logging. MicroSD expansion is useful but less reliable than internal storage.
Exact I/O Requirements: Confirm the number and type of ports (especially serial, DIO, USB). Are M12 connectors needed?
Environmental Specs: Verify IP rating, temperature range, and shock/vibe specs match your deployment site.
Software Compatibility: Test your critical Android apps on the actual hardware. Driver support for specific peripherals (e.g., specialized scanners) is crucial.
Security: How is the device secured (bootloader lock, verified boot, encryption, remote management)? Android in industrial settings needs hardening.
Manufacturer & Longevity: Who makes the "TPRO" series? (e.g., Teguar, AOPEN, Axiomtek have similar lines). What is their product lifecycle support?
Development & Management: Consider tools for remote monitoring, updates (MDM solutions), and kiosk mode lockdown.
In summary: The TPRO-156 ARM is a robust, fanless, touchscreen panel PC leveraging Android on an ARM processor for cost-effective, power-efficient, and touch-optimized industrial applications. It excels in environments requiring a sealed, reliable HMI with access to the Android ecosystem. Scrutinize the Android version, long-term support, and exact I/O configuration for your specific needs.
SKU | TPRO-156 ARM Widescreen |
Screen Size | 15.6” |
Resolution | 1920x1080 |
Viewing Angle | 89/89/89/89 |
Brightness | 250 cd/㎡ |
Contrast Ratio | 1000:1 |
Touchscreen | Capacitive, Resistive |
Controller | USB interface |
Durability | Capacitive: ≥ 5M times, Resistive: : ≥ 100,000 times |
Processor Family | ARM, Rockchip |
Memory Type | 2G, 4G, 8G |
Storage Type | 3588: 64G, 128G, 256G |
Ethernet / LAN | 2x LAN |
Serial / Com | 2x RS232 (1x COM option RS485) |
USB | 2x USB |
Video Outputs | 1x HDMI |
Expansion Slots | 1x Mini-PCIE |
Operating Systems | Android, LInux |
Dimension | 412 *261 *58. 6mm |
Mounting Hole Size | External embedded size:404 x253mm Internal embedded size: 397.5 x241.8mm |
Gross Weight | 3 . 80kg |
Mounting Options | Embedded, Wall Mount, Desktop Stand |
Operating Temperature | -30℃ ~ +70℃ |
Storage Temperature | -40℃ ~ +80℃ |
Humidity Rage Non-condensing | 5% - 95% |
Power | Input Voltage Range 9 – 36V DC Standard Power: Optional 12V AC/DC Adapter: 5A, 60W |
Fanless & Rugged Enclosure:
Fanless Cooling: Passive heatsink design within sealed enclosure. Eliminates dust ingress and fan failure points.
Construction: Aluminum or heavy-duty steel chassis.
Front Panel Rating: Typically IP65 (Dust-tight, protected against low-pressure water jets) - essential for washdown environments or dusty factories.
Ingress Protection: Overall unit rating often IP54/IP65 depending on model.
Wide Operating Temperature: -10°C to 50°C or -20°C to 60°C (common ranges, ARM chips handle extremes well).
Power Input: 12V DC or 24V DC (wide range like 9-36V DC possible) via terminal block or industrial connector. Includes power ignition control (optional).
Mounting: Panel Mount (Flush or Surface) with standard cutout size (e.g., 362.5 x 226.5mm). May include VESA mount options (75x75/100x100mm).
Certifications: CE, FCC, RoHS. Industrial EMC standards (EN 61000-6-2, EN 61000-6-4). May have MIL-STD-810G for shock/vibration.
Longevity & Reliability: Designed for 24/7 operation with industrial-grade components. Long-term OS support availability is a key question.
USB Ports: 2-4x USB 2.0/3.0 Host ports (Type-A, some ruggedized).
Serial Port: 1-2x RS-232/485 (DB9 or terminal block, often isolated).
Ethernet: 1-2x 10/100/1000 Mbps RJ45 (Gigabit).
Wi-Fi & Bluetooth: Integrated 802.11 a/b/g/n/ac/ax (Wi-Fi 5/6) and Bluetooth 4.2/5.0+.
Digital I/O (GPIO): 4-8x Isolated Inputs/Outputs(for sensors/relays).
Audio: Line-out/Mic-in (3.5mm jack or screw terminal).
Expansion: Mini-PCIe slot (for 4G/5G modem, CANbus card, extra storage).
Optional: CAN Bus 2.0B (critical for vehicles/machinery), PoE (Power over Ethernet), Barcode Scanner Input, Secondary Video Output(HDMI/LVDS).
Lower Cost: ARM SoCs are generally cheaper than equivalent x86 CPUs.
Ultra-Low Power: Minimal heat, ideal for sealed fanless designs.
Instant On/Fast Boot: Boots much faster than Windows/Linux.
Touch-Optimized UI: Android is inherently designed for touch interaction.
App Ecosystem: Access to vast number of Android apps (requires vetting for stability).
Simplified Development: Easier for creating custom HMIs using Android SDK/Kotlin/Java vs. traditional SCADA systems.
Industrial HMI (Human-Machine Interface):Machine control, process visualization, SCADA operator panels.
Factory Automation: Production line monitoring, quality control stations.
Kiosks & Interactive Signage: Wayfinding, self-service terminals, POS, menu boards.
Building Automation: HVAC control, security system panels, smart building interfaces.
Transportation: Fleet management terminals, in-vehicle infotainment (buses/trains), logistics tracking.
Medical Devices: Patient monitoring interfaces, diagnostic equipment UIs.
Thin Clients: Secure access to cloud/Virtual Desktop environments.
IoT Gateways & Edge Control: Running lightweight Android apps for data aggregation and local control.
Android Version & Support: What version is pre-installed? How long will security updates be provided? Is the kernel version locked? Can it be upgraded?
Processor Performance: ARM performance varies hugely (e.g., RK3568 vs. RK3588). Match the CPU to your app complexity (basic UI vs. video decoding/ML).
Storage & RAM: Ensure sufficient eMMC and RAM for your OS, apps, and data logging. MicroSD expansion is useful but less reliable than internal storage.
Exact I/O Requirements: Confirm the number and type of ports (especially serial, DIO, USB). Are M12 connectors needed?
Environmental Specs: Verify IP rating, temperature range, and shock/vibe specs match your deployment site.
Software Compatibility: Test your critical Android apps on the actual hardware. Driver support for specific peripherals (e.g., specialized scanners) is crucial.
Security: How is the device secured (bootloader lock, verified boot, encryption, remote management)? Android in industrial settings needs hardening.
Manufacturer & Longevity: Who makes the "TPRO" series? (e.g., Teguar, AOPEN, Axiomtek have similar lines). What is their product lifecycle support?
Development & Management: Consider tools for remote monitoring, updates (MDM solutions), and kiosk mode lockdown.
In summary: The TPRO-156 ARM is a robust, fanless, touchscreen panel PC leveraging Android on an ARM processor for cost-effective, power-efficient, and touch-optimized industrial applications. It excels in environments requiring a sealed, reliable HMI with access to the Android ecosystem. Scrutinize the Android version, long-term support, and exact I/O configuration for your specific needs.