23.6' Android Fanless Industrial Computer | VOPC-ARM236

SKU	VOPC-ARM236
'collaborative text Size'	23.6'
Resolution	1920 x1080
Viewing Anglus	89/89/89/89
splendor	250 cd/㎡
Confer Ratio	MMM:1
Touchscreen	Capacative
Controller	USB interface
Diuturnitatem	≥ 5M times
Processus Familiae	ARM, Rockchip
Memoria Type	2G, 4G, 8G
Aer / LAN	2x LAN
Vide / Com	2x RS232 (1x COM optio RS485)
USB	2x USB
Video Outputs	1x HDMI
Expansion justo	1x Mini PCIE
Operating Systems	Android, Linux
Dimension	572.1x345.6 x51.3mm
Adscendens foramen Location	567.6x341.2mm
Crassa Pondus	6.00kg
Adscendens Options	Embedded, Wall Mount, Desktop Stand
Temperature operating	-30℃ ~ +70℃
Repono Temperature	-40℃ ~ +80℃
Umor ira Non-condensatione	5% - 95%
Potestas	Input intentione Range 9 – 36V DC Standard Power: Libitum 12V AC/DC Adapter: 5A, 60W

Core Specifications & Architecture

Feature	VOPC-236 ARM Specifications
Ostendere	23.6 IPS LCD (1920×1080 FHD)
Processor	Rockchip RK3588 (4× Cortex-A76 @ 2.4GHz + 4× Cortex-A55)
AI Acceleratio	6 TOPS NPU (sustinet INT4/INT8/FP16)
OS	Android XII (AOSP) w / X annos LTS firmamentum
Memoria / at	8GB LPDDR5 + 128GB eMMC 5.1 (expandable per microSD)
Operans Temp	-20°C ad +60°C (fanless, aluminium heatsink)
Ingressus Praesidium	IP65 ante / IP42 rear
Potentia Input	24V DC (12-36V) vel PoE++ (802.3bt, 71W)
Construction	Caste aluminium gb, 5mm vitrum chemica roboratum

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Clavis Industrial Android Features

1. Gradus industriae Android Stack

• Tractus determinatus: Real-time inaequalis nucleus (Preempt-RT) pro ≤100 μs I/O latency

• Fieldbus Support: PROFINET, Modbus TCP, EtherCAT per OPC UA porta apps

• Secure Boot: fiduciae Hardware (TEE + TPM 2.0)

2. Ore AI Capabilities

• Framework Support: TensorFlow Lite, MediaPipe, ONNX Runtime ad NPU accelerationis

• Camera Integration: Dual MIPI-CSI (4-lane) pro 8MP cameras industriales

• Preloaded Tools: DeepView RT analytics suite (deprehensio defectus, OCR)

3. Ruggedization

• Vibratio Resistentia: 5Grms (IEC 60068-2-64)

• Conformal coating: PCB praesidium contra humiditatem / chemicals

• EMC Obsequium: EN 55032/35, IEC 61000-4-6;

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Industrial Connectivity

interface	Automation Usus Causa
Ager I / O *	8× GPIO (solatus 24V@100mA), 2× RS-485, 1× CAN 2.0B
Networking	Dual GbE w/ Norte, Wi-Fi 6E + BT 5.3 (M.2 Key E)
Expansion	USB 3.1 (Type-C w/ DP Alt), HDMI 2.0, M.2 M-key (NVMe)
Wireless	Libitum 5G/LTE (Quectel RM520N-GL)

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Scopum Applications

• CELLA Morsus: AMR Dashboards classis administratio (ROS 2 per Android NDK)

• Dolor Vestibulum: MES visualization cum OPC UA Pub/Sub

• Cibus & Potus: Washdown-compatible production vigilantia (IP65/NSF 49)

• Energy: Solaris fundus SCADA cum Modbus-TLS securitas

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Software Stack

Component	Industrial Implementation
PLC Integration	Ignitio Edge pro Android (Modbus / OPC UA)
HMI Development	VTScada Mobile, Siemens WinCC Unified
Continensation	Docker per Anbox (Android + Linux hybrid)
Securitas	Caeruleum sphaera super-the-aeris updates

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euismod Benchmarks

Workload	euismod
AI Conference	42 fps (YOLOv5s @ 640×640 INT8)
Real-Tempus Imperium	100 μs cyclus temporis (w/ Preempt-RT)
Ostendere Latency	8 ms (tactus-ad-responsum)
Virtus Consummatio	cacumen 12W/28W apicem (NPU activum);

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Instruere Best Practices

1. Scelerisque Management

• Ponere ≥20mm caeli gap post unitas in ambiente >50°C

• Applicare scelerisque interface pads (Laird Tflex HD900) inter PCB / gb

2. Android Hardening

• Inactivare USB debugging in productionem

• Usus Android Enterprise ad ac ante mode / omnino OS policies

3. Ager Integration

• Can/RS-485 cum ADuM3151BRWZgalvanic isolators

• Usus M12 connexiones pro vibratione-prone ambitus