SKU |
VOPC-236 ARMA |
'collaborative text Size' |
23.6' |
Resolution |
1920 x1080 |
Viewing Anglus |
89/89/89/89 |
splendor |
250 cd/㎡ |
Confer Ratio |
MMM:1 |
Touchscreen |
Capacative |
Controller |
USB interface |
Diuturnitatem |
≥ 5M times |
Processus Familiae |
ARM, Rockchip |
Memoria Type |
2G, 4G, 8G |
Aer / LAN |
2x LAN |
Vide / Com |
2x RS232 (1x COM optio RS485) |
USB |
2x USB |
Video Outputs |
1x HDMI |
Expansion justo |
1x Mini PCIE |
Operating Systems |
Android, Linux |
Dimension |
572.1x345.6 x51.3mm |
Adscendens foramen Location |
567.6x341.2mm |
Crassa Pondus |
6.00kg |
Adscendens Options |
Embedded, Wall Mount, Desktop Stand |
Operating Temperature |
-30℃ ~ +70℃ |
Repono Temperature |
-40℃ ~ +80℃ |
Umor ira Non-condensatione |
5% - 95% |
Potestas |
Input intentione Range 9 – 36V DC Standard Power: Libitum 12V AC/DC Adapter: 5A, 60W |
| Feature | VOPC-236 ARM Specifications |
|---|---|
| Ostendere | 23.6 IPS LCD (1920×1080 FHD) |
| Processor | Rockchip RK3588 (4× Cortex-A76 @ 2.4GHz + 4× Cortex-A55) |
| AI Acceleratio | 6 TOPS NPU (sustinet INT4/INT8/FP16) |
| OS | Android XII (AOSP) w / X annos LTS firmamentum |
| Memoria / at | 8GB LPDDR5 + 128GB eMMC 5.1 (expandable per microSD) |
| Operans Temp | -20°C ad +60°C (fanless, aluminium heatsink) |
| Ingressus Praesidium | IP65 ante / IP42 rear |
| Potentia Input | 24V DC (12-36V) vel PoE++ (802.3bt, 71W) |
| Construction | Caste aluminium gb, 5mm vitrum chemica roboratum |
Gradus industriae Android Stack
Tractus determinatus: Real-time inaequalis nucleus (Preempt-RT) pro ≤100 μs I/O latency
Fieldbus Support: PROFINET, Modbus TCP, EtherCAT per OPC UA porta apps
Secure Boot: fiduciae Hardware (TEE + TPM 2.0)
Ore AI Capabilities
Framework Support: TensorFlow Lite, MediaPipe, ONNX Runtime ad NPU accelerationis
Camera Integration: Dual MIPI-CSI (4-lane) pro 8MP cameras industriales
Preloaded Tools: DeepView RT analytics suite (deprehensio defectus, OCR)
Ruggedization
Vibratio Resistentia: 5Grms (IEC 60068-2-64)
Conformal coating: PCB praesidium contra humiditatem / chemicals
EMC Obsequium: EN 55032/35, IEC 61000-4-6;
| interface | Automation Usus Causa |
|---|---|
| Ager I / O * | 8× GPIO (solatus 24V@100mA), 2× RS-485, 1× CAN 2.0B |
| Networking | Dual GbE w/ Norte, Wi-Fi 6E + BT 5.3 (M.2 Key E) |
| Expansion | USB 3.1 (Type-C w/ DP Alt), HDMI 2.0, M.2 M-key (NVMe) |
| Wireless | Libitum 5G/LTE (Quectel RM520N-GL) |
CELLA Morsus: AMR Dashboards classis administratio (ROS 2 per Android NDK)
Dolor Vestibulum: MES visualization cum OPC UA Pub/Sub
Cibus & Potus: Washdown-compatible production vigilantia (IP65/NSF 49)
Energy: Solaris fundus SCADA cum Modbus-TLS securitas
| Component | Industrial Implementation |
|---|---|
| PLC Integration | Ignitio Edge pro Android (Modbus / OPC UA) |
| HMI Development | VTScada Mobile, Siemens WinCC Unified |
| Continensation | Docker per Anbox (Android + Linux hybrid) |
| Securitas | Caeruleum sphaera super-the-aeris updates |
| Workload | euismod |
|---|---|
| AI Conference | 42 fps (YOLOv5s @ 640×640 INT8) |
| Real-Tempus Imperium | 100 μs cyclus temporis (w/ Preempt-RT) |
| Ostendere Latency | 8 ms (tactus-ad-responsum) |
| Virtus Consummatio | cacumen 12W/28W cacumen (NPU activum); |
Scelerisque Management
Ponere ≥20mm caeli gap post unitas in ambiente >50°C
Applicare scelerisque interface pads (Laird Tflex HD900) inter PCB / gb
Android Hardening
Inactivare USB debugging in productionem
Usus Android Enterprise ad ac ante mode / omnino OS policies
Ager Integration
Can/RS-485 cum ADuM3151BRWZgalvanic isolators
Usus M12 connexiones pro vibratione-prone ambitus
