TPRO-SE133
VINCANWO GROUP
IP66 Front Bezel
OEM
| Availability: | |
|---|---|
| Quantitas: | |
SKU |
TPRO-SE133 |
'collaborative text Size' |
13.3' |
Resolution |
1920*1080 |
Viewing Anglus |
85/85/85/85 |
splendor |
300 cd/m2 |
Confer Ratio |
800:1 |
Tactus Screen |
Capacative |
Controller |
USB interface |
Diuturnitatem |
≥5M temporibus |
Processor |
Intel® Processors |
Memoria |
4G/8G/16G/32G |
Storag |
128G/256G/512G/1T |
Network |
2 *RTL8111 |
COM |
2 * RS232 (COM2 ad libitum RS485 et expansio ad 5COMs) |
USB |
2 *USB3.0 + 2 *USB2.0 |
Ostendere |
1 *HDMI, 1 *VGA |
Expansion |
I * Mini PCIE WiFi&BT vel 4G LTE |
Ratio operating |
Windows / Linux |
Dimensiones (mm) |
337* 208.5*52 |
Commendatur magnitudo foraminum ostium (mm) |
331.5*203 |
Crassa pondus (kg) |
3.50kg |
Modi institutionem |
Embedded / Murus mons / Desktop |
Operating Temperature |
-30 ~ +70°C |
Repono Temperature |
-40 ~ +80°C |
Repono Umor *Non-condensing |
5 ~ 95% |
Potentia Input |
1*12VDC(6A) |
Packaging Information |
1 *Magister, 1 * Transformer, 1* Power Supple Cable |

| Feature | TPRO-SE133 Specifications |
|---|---|
| Forma factor | 1U/2U rackmount (vexillum 19' width) |
| Ostendere | Libitum 13.3' LCD (panel front) resistentibus / P-CAP tactus |
| Processor | Intel® Core™ i5/i7/i9 (12th/13th Gen) or Xeon® E-series |
| RAM | Usque ad 64GB DDR5 ECC SODIMM |
| Repono | Dual M.2 NVMe (2280) + 2x 2.5\ |
| Potentia Input | 24V DC (primaria) + 100-240V AC backup |
| Operans Temp | -40° C ad 70° C (conformalibus coating) |
| Ruggedization | Vibratio resistens gb, IP40 frons, MIL-STD-810H obsecundantia |
Eculeo-Optimized Architecture
Instrumentum minus Rail Kits: Slide cancellum pro celeri instruere in 19' repositoria.
Front-Access I/O: USB 3.2, HDMI, OOB procuratio portus inserviendi.
Dualis potestas: superuacua 300W PSUs (DC + AC) ad applicationes criticas.
Ora Computing Capabilities
AI Acceleratio: M.2 A-clavis socors pro Intel Movidius/Google Coral TPU.
5G/LTE Support: M.2 B-clavem socors ad modulorum cellularum (Quectel RM500Q).
Real-Time OS Support: Preloaded with Ubuntu RT, QNX, or Wind River VxWorks.
Industrial Connectivity
Legatum I/O: 2x RS-232/485 (solitudo), 8x GPIO, CAN Bus 2.0B.
Celeritas Networking: Dual 10GbE SFP+, 4x GbE RJ45 (Intel i225).
Expansio: Plu x8 card risi (sustentat GPUs, frame grabbers).
Factory 4.0: productio realis-vicis magna, predictive conservatio.
Transportation: Onboard computa pro impedimenta/AVGs (EN 50155 variantes certificati).
Energy: Substantia automatio (IEC 61850-3 obsequi).
Defensio: Praeceptum mobile centra (MIL-STD-461G EMI protegens).
| Pluma | Fructus |
|---|---|
| Latitudo normatum | Integra existentia 19' repositoria control, cubicula servans. |
| Summus densitas | Congruat 42 unitates per eculeum (1U) → maximizas in spatio stricto computant. |
| Serviceability | Hot-VERTO agitet/redundant PSUs sustentationem sine downtime enable. |
| Scalability | Stack unitates multiplices pro glomerati ore computando (Kubernetes/K3s). |
| Necessitas | TPRO-SE133 Solutio |
|---|---|
| Temperature Resilience | Conformal coating + late temp range (-40°C ad 70°C) |
| Testimonia | CE, FCC, EN 50121-3-2 (ferriviarium) |
| Inpulsa / Resistentia Vibe | MIL-STD-810H Methodus 514,8 (30G operational) |
| Securitas | TPM 2.0, secura tabernus, Kensington clausum socors |
| Management | IPMI 2.0, Redfish API, SNMP v3 support |
Refrigerium: Pone ≥ 1U alvi supra/infra unitatem; utere eculeo fans si ambiens >50°C.
Potentia: Usus industrialis 24V DC UPS (exempli gratia PULS DIMENSIONE) pro tutela fusca.
Cabling: Strain-relevamen fibulae pro instructionibus mobilibus (eg, vehiculis fodiendis).
EMC: Terra gb eculeo; utere telo Cat 6A/7 funes in ambitus strepitus magnos.
Semper cognoscere:
MTBF: ≥ 200,000 horarum (per Telcordia SR-332 computata).
Warranty: 5-annus coverage (vexillum pro PCs industriae).
Obsequium: Regio-certorum specialium (eg, EAC pro Eurasia, KC pro Corea).